WaferStorm Wet Processing Platform

The WaferStorm platform is the industry choice for a number of critical solvent-based processes in the advanced packaging, MEMs, RF, Data Storage and Photonics markets. There are 2 versions- the Manual Load (ML) and 3300 series platforms. The ML system is well suited for R&D and pilot environments. The 3300-series platform is the high-volume work horse of the industry.

The 3300-series architecture is extremely flexible as the user can have up to 8 chambers per system depending on throughput requirements. In addition, the system is capable of handling multiple wafer sizes and wafer types with minimal hardware modification. Lastly, the process chambers can be stacked vertically leading to extremely low system footprint.

System Architecture

High Volume Platform – 3300 series

1 – 10 chamber modular system
Low footprint- stacked chambers
On board chemical supply
Multiple wafer sizes- 50 to 300mm
Multiple substrate types – Si, LiTaO3, Sapphire, Glass

Manual load platform for R&D – ML

Single chamber- manual load

WaferStorm 3300 Series Platform Manual Load Platform

Solvent Applications

Metal Lift-Off

Metal Lift-Off (MLO) is a critical process in the compound semiconductor and RF markets where metals cannot be easily etched without damaging the underlying substrates. The WaferStorm system with ImmJET technology is the market share leader for Metal Lift-Off globally. ImmJET technology is a combination of batch immersion and single wafer spray processing. The immersion step uses heated solvents with agitation. After being softened by the immersion, the wafers are transferred to the single-wafer spray station where they are exposed to high-pressure fan sprays with heated solvents for rapid removal of thick film residue. This combination ensures superior process performance while maintaining the lowest CoO versus wet bench and single wafer solutions.

Photoresist/Dry Film Strip

The WaferStorm system with ImmJET technology delivers superior process performance and low cost of ownership for the customer for photoresist strip and dry film strip applications. Especially, when the resists are thick and difficult to remove, the combined immersion and high-pressure spray ensures material removal. In addition, proprietary filtration technology enables low downtime and high productivity.

Flux Clean

在先进封装领域，焊剂清洁对于晶片凸起和接点形成过程非常关键，因为它要去除氧化层和其他焊锡材料留下的杂质以确保获得用于下个装配步骤的干净金属表面。由于液态焊接剂被带至凸起表面，所以必须使用额外的清洗步骤才能去除留下的残留。由于凸点间距变得更加精细，导致去除焊剂残留也变得更具挑战性。Veeco 在 WaferStorm 平台中提供的专有浸泡喷雾技术特别适合从最密集的空间中去除焊剂残留。

Scrubber

Veeco PSP 的单面和双面单晶圆清洁技术可以在许多应用中实现高效的颗粒去除。Veeco 的专利双面 PVA 刷系统可清洁顶部、底部和侧面。除了高速喷雾 (HVS) 和 Megasonics，还可以使用其他单面 PVA 刷擦洗技术，以便在所有晶圆尺寸上获得最有效的清洁效果。

TSV Clean

TSV 清洗是一个关键的工艺步骤，对于实现可靠性必不可少。深反应离子蚀刻 (DRIE) 工艺留下的聚合物残留可导致在屏蔽层中出现缺陷和空隙，从而干扰后面的步骤。The WaferStorm with ImmJET technology relies on the sequential combination of the immersion and high-pressure spray processes to remove residues in high-aspect-ratio holes that wet bench-only or spray-only tools leave behind.